Light emitting device and light source module

ABSTRACT

A light emitting device and a light source module are provided. The light emitting device includes a base, a conductive unit, a light unit, and a package. The base includes a first substrate and n through holes, and the through holes pass through the first substrate. The conductive unit includes m conductors that are separate from each other, and the conductors pass through the first substrate. The light unit is electrically connected to the conductors. The package includes a first package body surrounding the light unit and a second package body covering the light unit and the first package body. The first package body and the second package body have different optical properties. Furthermore, m and n are integers greater than or equal to 2, and m is greater than or equal to n.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims priority to the U.S. Provisional PatentApplication Ser. Nos. 63/121,981 filed on Dec. 7, 2020 and 63/188,475filed on May 14, 2021, and to China Patent Application No.202122805925.1 filed on Nov. 16, 2021 in People's Republic of China,which applications are incorporated herein by reference in its entirety.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a light emitting device and a lightsource module, and more particularly to a light emitting device and alight source module in which light emitting efficiency can be improved.

BACKGROUND OF THE DISCLOSURE

The Light Emitting Diode (LED) has the advantages of small size, highluminous efficiency, environmental protection, low energy consumption,and long production life, and is widely used in various fields. Withincreasing requirements of LED applications, a design with four whitewalls surrounding an encapsulate has been applied in conventionalpackaging of LED. However, such a design not only limits light emittingefficiency of LED, but also restricts an overall size of LED packagingstructure, which in turn affects an application thereof in thedevelopment of miniaturized end product.

Therefore, how to improve a structural design to overcome the aboveissues has become one of the important issues to be addressed in therelated field.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacy the presentdisclosure provides a light emitting device and a light source module.

In one aspect, the present disclosure provides a light emitting devicewhich includes a base, a conductive unit, a light unit, and a package.The base at least includes a first substrate and n through holes, andeach of the n through holes passes through the first substrate. Theconductive unit includes m conductors that are separate from each other,and each of the m conductors passes through the first substrate. Each ofthe m conductors includes a chip bonding pad, a solder pad, and a firstconnection. The chip bonding pad is disposed on a top surface of thebase, the solder pad is exposed from a bottom surface of the base, andthe first connection is connected between the chip bonding pad and thesolder pad. A part of the first connection is arranged in the throughhole. The light unit is correspondingly and electrically connected tothe m conductors. The package includes a first package body surroundingthe light unit and a second package body covering the light unit and thefirst package body. The first package body and the second package bodyhave different optical properties. Furthermore, m and n are integersgreater than or equal to 2, and m is greater than or equal to n.

In another aspect, the present disclosure provides a light emittingdevice, which includes a base, a conductive unit, a light unit, and apackage. The base at least includes a first substrate and n throughholes, and each of the n through holes passes through the firstsubstrate. The conductive unit includes m conductors that are separatefrom each other, and each of the m conductors passes through the firstsubstrate. Each of the m conductors includes a chip bonding pad, asolder pad, and a first connection. The chip bonding pad is disposed ona top surface of the base, the solder pad is exposed from a bottomsurface of the base, and the first connection is connected between thechip bonding pad and the solder pad. A part of the first connection isarranged in the through hole. The light unit is correspondingly andelectrically connected to the m conductors. The light unit includes atleast one chip scale packaging light emitting diode (CSP-LED). The atleast one CSP-LED includes an encapsulate formed on a light emittingchip, and the encapsulate and the package have different opticalproperties. Furthermore, m and n are integers greater than or equal to2, and m is greater than or equal to n.

In yet another aspect, the present disclosure provides a light sourcemodule, which includes a circuit board, at least one light emittingdevice as described above, and a light guide member. The at least onelight emitting device is disposed on the circuit board, and is solderedto the circuit board through the first connections respectively disposedin the through holes. The light guide member is adjacent to anilluminating surface of the at least one light emitting device.

Therefore, in the light emitting device and the light source moduleprovided by the present disclosure, by virtue of “the package includingthe first package body surrounding the light unit and the second packagebody covering the light unit and the first package body, and the firstpackage body and the second package body having different opticalproperties,” a size of the light emitting device can be reduced so as toachieve an effect of miniaturization, and light emitting efficiency canbe effectively improved.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments may be better understood by reference to thefollowing description and the accompanying drawings, in which:

FIG. 1A and FIG. 1B are respectively a schematic cross-sectional viewand a schematic perspective view of a light emitting device according toa first embodiment of the present disclosure;

FIG. 2A and FIG. 2B respectively show a first patterned metal layer anda second patterned metal layer of a base of the light emitting deviceaccording to the first embodiment of the present disclosure;

FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B, and FIG. 5 are schematic viewscorrespondingly showing a contact part of a first package body of thelight emitting device in a shape of a round corner, a bevel, and anarcuate slot according to the first embodiment of the presentdisclosure;

FIG. 6A is a schematic top view of the light emitting device accordingto the first embodiment of the present disclosure;

FIG. 6B is a cross-sectional view taken along line VIB-VIB of FIG. 6A;

FIG. 6C is another schematic top view of the light emitting deviceaccording to the first embodiment of the present disclosure;

FIG. 6D is a cross-sectional view taken along line VID-VID of FIG. 6C;

FIG. 6E is another schematic top view of the light emitting deviceaccording to the first embodiment of the present disclosure;

FIG. 6F is a cross-sectional view taken along line VIF-VIF of FIG. 6E;

FIG. 7A is another schematic top view of the light emitting deviceaccording to the first embodiment of the present disclosure;

FIG. 7B is a cross-sectional view taken along line VIIB-VIIB of FIG. 7A;

FIG. 7C is another schematic perspective view of the light emittingdevice according to a first embodiment of the present disclosure;

FIG. 8A is another schematic top view of the light emitting deviceaccording to the first embodiment of the present disclosure;

FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB of FIG.8A;

FIG. 9 is a schematic structural view of a base, a conductive unit, anda light unit of a light emitting device according to a second embodimentof the present disclosure;

FIG. 10A, FIG. 10B, FIG. 10C, and FIG. 10D are schematic plan viewscorrespondingly showing patterned metal layers of the base according tothe second embodiment of the present disclosure;

FIG. 11A, FIG. 11B, FIG. 11C, and FIG. 11D are another schematic planviews correspondingly showing the patterned metal layers of the baseaccording to the second embodiment of the present disclosure;

FIG. 12 is a schematic structural view of a base and a conductive unitaccording to a third embodiment of the present disclosure;

FIG. 13A is a cross-sectional view of a light emitting device accordingto a fourth embodiment of the present disclosure;

FIG. 13B is a schematic perspective view of the light emitting device ofFIG. 13A;

FIG. 13C is another cross-sectional view of the light emitting deviceaccording to the fourth embodiment of the present disclosure;

FIG. 14A is another cross-sectional view of the light emitting deviceaccording to the fourth embodiment of the present disclosure;

FIG. 14B is a schematic perspective view of the light emitting device ofFIG. 14A; and

FIG. 15A and FIG. 15B are schematic views of a light source moduleaccording to a fifth embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

First Embodiment

Referring to FIG. 1A and FIG. 1B, a first embodiment of the presentdisclosure provides a light emitting device S, which includes a base 1,a conductive unit 2, a light unit 3, and a package 4.

The base 1 can be a single-layer board or a multi-layer board structure,i.e., the base 1 at least includes a first substrate 11. In addition,the base 1 also includes at least n through holes, and each of the nthrough holes passes through one side the first substrate 11, where n isa positive integer and at least greater than 2. The first substrate 11can be a flexible printed circuit (FPC), an FR4 substrate, a prepreg(PP), or glass, but is not limited thereto. It should be noted that, inthe present embodiment, the base 1 is the single-layer board structure.

The conductive unit 2 includes m conductors 21 that are separate fromeach other, and each of the m conductors 21 passes through the base 1,where m is a positive integer and at least greater than 2. Each of the mconductors 21 includes a chip bonding pad 211, a solder pad 212, and afirst connection 213. The chip bonding pad 212 is disposed on a topsurface of the base 1. The solder pad 212 is exposed from a bottomsurface of the base 1. The first connection 213 is connected between thechip bonding pad 211 and the solder pad 212 and passes through the base1. A part of the first connection 213 is arranged in the through hole110. In the present embodiment, the conductor 21 can be metal or alloywith high electrical conductivity coated on an inner semi-circular orsemi-elliptical shape surface of the through hole 110, but is notlimited thereto.

The light unit 3 is disposed on the chip bonding pad 211 on the topsurface of the base 1, so as to be electrically connected to theconductor 21. The light unit 3 can include at least one light emittingchip. In the present embodiment, the light unit 3 includes two lightemitting diodes, and the two light emitting diodes can have samewavelength or different wavelengths, which can be adjusted according toa user's requirement or an actual application. Moreover, the light unit3 can include two flip light emitting chips that each include an N-typepad and a P-type pad, and the N-type pad and the P-type pad are disposedon a bottom surface of the flip light emitting chip and are respectivelyand electrically connected to two corresponding ones of the chip bondingpads 211 of the conductor 21. That is to say, each of the two flip lightemitting chips is arranged between the two corresponding ones of thechip bonding pads 211 of the conductor 21.

Further, as shown in FIG. 2A and FIG. 2B, since the chip bonding pad 211and the solder pad 212 of the conductive unit 2 are correspondinglyarranged in the first substrate 11, the base 1 can be regarded asincluding a plurality of patterned metal layers. That is, the base 1includes a first patterned metal layer 1 a formed on a top of the base 1and a second patterned metal layer 1 b formed on a bottom of the base 1,and the plurality of patterned metal layers of the base 1 can beadjusted according to the user's requirement or the actual application.For example, when the light unit 3 includes two light emitting diodes,as shown in FIG. 2A and FIG. 2B, the first patterned metal layer 1 aincludes a plurality of square portions or circular portions that eachhas an extension part, and the second patterned metal layer 1 b includesa plurality of arched portions that each has a recess. In a preferredembodiment, the extension part of the first patterned metal layer 1 ahas at least one outwardly arced surface. Furthermore, any two extensionparts that correspond to a same light emitting diode have individuallyand outwardly arced surface. When the light unit includes two lightemitting diodes, a distance between any two extension parts thatrespectively correspond to the two light emitting diodes and areadjacent to each other is less than a distance between any two extensionparts that correspond to a same light emitting diode, so that a size ofthe light emitting device S can be effectively reduced. The firstpatterned metal layer 1 a and the second patterned metal layer 1 b havean equal number of patterns (e.g., in the present embodiment, the numberof patterns of the first patterned metal layer 1 a and the number ofpatterns of the second patterned metal layer 1 b both are four), and atleast a part of the first patterned metal layer 1 a and at least a partof the second patterned metal layer 1 b correspond to each other, sothat a conductive path is provided. It is worth mentioning that, in thepresent embodiment, the recess of the second patterned metal layer 1 bis connected to one side of the base 1, and the extension part of thefirst patterned metal layer 1 a also extends toward the one side of thebase 1. A part of the recess of the second patterned metal layer 1 b anda part of the extension part of the first patterned metal layer 1 acorrespond to each other. Moreover, a width of the extension part of thefirst patterned metal layer 1 a is larger than a width of the squareportion or the circular portion of the first patterned metal layer 1 a.On the other hand, when viewed from the top surface of the base 1, thenumber of patterns of the first patterned metal layer 1 a represents anumber of the conductors 21 of the conductive unit 2. In addition, sincea part of the first connection 213 is arranged in the through hole 110,the number of patterns of the second patterned metal layer 1 brepresents a number of the through holes 110. Therefore, in the presentembodiment, the number of the conductors 21 is equal to the number ofthe through holes 110, i.e., m is equal to n.

The package 4 includes a first package body 41 and a second package body42. The first package body 41 surrounds the light unit 3 and covers apart of the chip bonding pad 211 of the conductor 21 that is exposed,and the second package body 42 covers the light unit 3 and the firstpackage body 41. Further, the first package body 41 and the secondpackage body 42 each can be a colloid, and can have different opticalproperties. For example, but not limited to, the first package body 41is optically opaque, and the second package body 42 is opticallytranslucent. Alternatively, the first package body 41 is opticallytranslucent, and the second package body 42 is optically opaque. Morespecifically, when the first package body 41 includes a reflectivematerial (or a light-absorbing material), the second package body 42includes a translucent material. Alternatively, when the first packagebody 41 includes the translucent material, the second package body 42includes the reflective material (or the light-absorbing material).Moreover, the reflective material can be silicon oxide, titanium oxide,or a combination thereof, and the translucent material can betransparent resin, a phosphor, semitransparent resin, etc. In apreferred embodiment, the first package body 41 includes the reflectivematerial such as silicon oxide, titanium oxide, or the combinationthereof, and the second package body 42 includes the translucentmaterial such as the transparent resin, the phosphor, thesemitransparent resin, etc. It should be noted that, the first packagebody 41 and the second package body 42 can be disposed by knowntechniques, which are not reiterated herein.

Further, in the present embodiment, a maximum thickness of the firstpackage body 41 is greater than or equal to a height of the light unit3, i.e., when the first package body 41 surrounds the light unit 3, atop surface of the first package body 41 is higher than a top surface ofthe light unit 3, so that the first package body 41 can be completelyadjacent to a periphery of the light unit 3. In addition, a ratio of athickness of the second package body 42 to the thickness of the firstpackage body 41 can be adjusted to between 0.5 and 2, so that lightemitting efficiency of the light unit 3 can be effectively improvedthrough an arrangement of the first package body 41 and the secondpackage body 42. Moreover, a surface of the first package body 41preferably can be a roughened structure, such that total reflection ofincident light can be increased, thereby further enhancing the lightemitting efficiency of the light unit 3.

Furthermore, as shown in FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B, and FIG. 5, the first package body 41 has a contact part 411, and the contact part411 is adjacent to the light unit 3. It should be noted that, thecontact part 411 has a surface 4111, and the surface 4111 can be in ashape of a round corner, a bevel, or an arcuate slot, but the surface411 can be adjusted according to the user's requirement or the actualapplication. In addition, a maximum thickness of the contact part 411 isless than or equal to 1.5 times a height of the light unit 3, and aminimum thickness of the contact part 411 is greater than or equal to0.5 times the height of the light unit 3, such that the light emittingefficiency of the light unit 3 can be effectively improved.

More specifically, the contact part 411 has a first terminal and asecond terminal. The first terminal contacts an intersection of the topsurface and a side surface of the light unit 3 or the side surface ofthe light unit 3, and the second terminal does not contact the lightunit 3. In one embodiment, as shown in FIG. 3A, FIG. 3B, FIG. 4A, andFIG. 4B, when the surface 4111 of the contact part 411 is in the shapeof the round corner or the bevel, a height from a bottom surface of thefirst package body 41 to the first terminal of the contact part 411(i.e., the minimum thickness of the contact part 411) can be equal to orless than the height of the light unit 3, and a height from the bottomsurface of the first package body 41 to the second terminal of thecontact part 411 (i.e., the maximum thickness of the contact part 411)can be equal to or greater than the height of the light unit 3. Inanother embodiment, as shown in FIG. 5 , when the surface 4111 of thecontact part 411 is in the shape of the arcuate slot, the contact part411 further has a recess, which is arranged between the first terminaland the second terminal, and the height from the bottom surface of thefirst package body 41 to the first terminal is approximately equal tothe height from the bottom surface of the first package body 41 to thesecond terminal. That is to say, the height from the bottom surface ofthe first package body 41 to the first terminal (i.e., the maximumthickness of the contact part 411) can be approximately equal to theheight of the light unit 3, and a height from the bottom surface of thefirst package body 41 to a bottom of the recess of the contact part 411(i.e., the minimum thickness of the contact part 411) can be equal to orless than the height of the light unit 3.

Referring to FIG. 6A to FIG. 6F, the package 4 can also include at leastone first reflective structure 43, which is arranged on the firstpackage body 41 and is adjacent to the second package body 42, and athickness of the first reflective structure 43 is equal to a thicknessof the second package body 42. The first reflective structure 43 can bemade of the same material as the first package body 41 or the secondpackage body 42, but the present disclosure is not limited thereto.

In the present embodiment, the first reflective structure 43 iscorrespondingly adjacent to two sides of the second package body 42 thatare opposite to each other. That is to say, a number of the firstreflective structures 43 can be two, and the two first reflectivestructures 43 can be arranged adjacent to two short sides of the secondpackage body 42 (i.e., the two first reflective structures 43 areparallel to two short sides of the base 1 that are opposite to eachother) or to two long sides of the second package body 42 (i.e., the twofirst reflective structures 43 are parallel to two long sides of thebase 1 that are opposite to each other). Alternatively, the firstreflective structure 43 can also be surroundingly arranged at aperiphery of the second package body 42.

Referring to FIG. 7A, FIG. 7B, FIG. 7C, FIG. 8A, and FIG. 8B, in thepresent embodiment, the light unit 3 includes three light emittingdiodes, and light emitted by the three light emitting diodes can havesame wavelength or different wavelengths, which can be adjustedaccording to the user's requirement or the actual application. Forexample, the three light emitting diodes can respectively emit redlight, green light, and blue light, and the three light of differentcolors emitted by the three light emitting diodes can be mixed evenly soas to produce color light or white light on demand, but the presentdisclosure is not limited thereto. The package 4 can also include athird package body 44, which is arranged on the second package body 42.That is to say, the third package body 44, the second package body 42,and the first package body 41 can be a top-down stacked structure. Itshould be noted that, the third package body 44 and the second packagebody 42 are made of different materials. In a preferred embodiment, thesecond package body 42 includes the translucent material such as one ofthe transparent resin, the phosphor, and the semitransparent resin, andthe third package body 44 includes a rest of the transparent resin, thephosphor, and the semitransparent resin. In a more preferred embodiment,the second package body 42 includes the phosphor, and the third packagebody 44 includes the transparent resin or the semitransparent resin. Inaddition, a ratio of a thickness of the third package body 44 to thethickness of the first package body 41 can be adjusted to be between 0.5and 2, i.e., thickness of the third package body 44 and the thickness ofthe second package body 42 can be equal or unequal. Therefore, throughan arrangement of the first package body 41, the second package body 42,and the third package body 44, the light emitting efficiency of thelight unit 3 can be effectively improved.

Referring to FIG. 8A and FIG. 8B, the package 4 can also include asecond reflective structure 45, which is arranged on the first packagebody 41, and a thickness of the second reflective structure 45 is equalto a total thickness of the second package body 42 and the third packagebody 44. The second reflective structure 45 can be made of the samematerial as the first package body 41, the second package body 42, orthe third package body 44, but the present disclosure is not limitedthereto.

In the present embodiment, the second reflective structure 45 iscorrespondingly adjacent to the same one of two sides of the secondpackage body 42 and the third package body 44 that are opposite to eachother. That is to say, a number of the second reflective structure 45can be two, and the second reflective structure 45 can be regarded as anextension part of the first reflective structure 41 as described abovethat extends toward a top surface of the light emitting device S. Thetwo second reflective structures 45 can be arranged adjacent to twoshort sides correspondingly of the second package body 42 and the thirdpackage body 44 (i.e., the two second reflective structures 45 areparallel to the two short sides of the base 1 that are opposite to eachother) or to two long sides correspondingly of the second package body42 and the third package body 44 (i.e., the two second reflectivestructures 45 are parallel to the two long sides of the base 1 that areopposite to each other). Alternatively, the second reflective structure45 can also be surroundingly arranged at a periphery of the secondpackage body 42 and the third package body 44.

However, the aforementioned details are disclosed for exemplary purposesonly, and are not meant to limit the scope of the present disclosure.

Second Embodiment

Referring to FIG. 9 , a main difference between a second embodiment andthe first embodiment is that, the base 1 of the second embodiment is amulti-layer structure, which includes the first substrate 11, a secondsubstrate 12, and an adhesive layer 13 connected between the firstsubstrate 11 and the second substrate 12. The second substrate isarranged between the first substrate 11 and the light unit 3, i.e., thesecond substrate 12, the adhesive layer 13, and the first substrate 11are arranged from top to bottom. The first substrate 11 and the secondsubstrate 12 can be made of the same material or different materials.For example, the first substrate 11 can be the FR4 substrate or theprepreg (PP), and the second substrate 12 can be the prepreg (PP) or theFR4 substrate, but is not limited thereto. In the present embodiment,the conductive unit 2 includes multiple ones of the conductors 21 eachincluding the first connection 213 connected to the solder pad 212 on abottom surface of the first substrate 11 and passing through the firstsubstrate 11, and a second connection 214 connected to the chip bondingpad 211 on a top surface of the second substrate 12 and passing throughthe second substrate 12. In addition, the adhesive layer 13 can be madeof a polymer material. The adhesive layer 13 includes an intermediateconductive part 215, which is a single-layer or a multi-layer structurearranged on a bottom surface of the second substrate 12, a top surfaceof the first substrate 11, or both the bottom surface of the secondsubstrate 12 and the top surface of the first substrate 11. Each of anorthographic projection of the first connection 213 and an orthographicprojection of the second connection 214 corresponds to the intermediateconductive part 215, so that the first connection 213 is electricallyconnected to the second connection 214 through the intermediateconductive part 215, thereby providing an electrical conductive path.

Further, as shown in FIG. 9 , FIG. 10 , and FIG. 11 , the chip bondingpad 211, the second connection part 214, the intermediate conductivepart 215, and the solder pad 212 of the conductive unit 2 are arrangedbetween the top surface of the second substrate 12 to the bottom surfaceof the first substrate 11, so that the base 1 can be regarded asincluding a plurality of patterned metal layers. That is, the base 1includes a top patterned metal layer 1 c, a second substrate patternedmetal layer 1 d, a first patterned metal layer 1 a, and a secondpatterned metal layer 1 b, and the plurality of patterned metal layersof the base 1 can be adjusted according to the user's requirement or theactual application. For example, the top patterned metal layer 1 cincludes a plurality of square portions, the second substrate patternedmetal layer 1 d includes a plurality of circular portions, and the toppatterned metal layer 1 c and the second substrate patterned metal layer1 d have an equal number of patterns. The first patterned metal layer 1a includes a plurality of circular portions that each has an extensionpart, and the second patterned metal layer 1 b includes a plurality ofarched portions that each has an recess. The first patterned metal layer1 a and the second patterned metal layer 1 b have an equal number ofpatterns, and at least a part of the first patterned metal layer 1 acorresponds to at least a part of the second patterned metal layer 1 b,so that a conductive path is provided. It is worth mentioning that, inthe present embodiment, a concave side of each of the plurality ofpatterned metal layers that each is in the shape of the arch of thesecond patterned metal layer 1 b is connected to one side of the firstsubstrate 11, and the extension part of the first patterned metal layer1 a also extends toward and is connected to the one side of the firstsubstrate 11. On the other hand, when viewed from the top surface of thebase 1, the number of patterns of the top patterned metal layer 1 crepresents a number of the conductors 21 of the conductive unit 2. Inaddition, since a part of the first connection 213 is arranged in thethrough hole 110, the number of patterns of the second patterned metallayer 1 b represents a number of the through holes 110. Therefore, thenumber of the conductors 21 is greater than or equal to the number ofthe through holes 110, i.e., m is greater than or equal to n.

Furthermore, as shown in FIG. 11A, FIG. 11B, FIG. 11C, and FIG. 11D, thenumbers of patterns of the top patterned metal layers 1 c and the secondsubstrate patterned metal layer 1 d are both four, and the numbers ofpatterns of the first patterned metal layer 1 a and the second patternedmetal layer 1 b are both three. That is, in the base 1, one of the firstconnections 213 can be shared by two light emitting diodes of the lightunit 3 through a manner of serial connection or a manner of parallelconnection. Therefore, two N-type pads respectively disposed on thebottom surfaces of the two light emitting diodes of the light unit 3 canbe arranged adjacent to each other (i.e., the electrode pads on thebottom surface of the two light emitting diodes are arranged in an orderof P-type pad, N-type pad, N-type pad, and P-type pad), or two P-typepads respectively disposed on the bottom surfaces of the two lightemitting diodes of the light unit 3 can be arranged adjacent to eachother (i.e., the electrode pads on the bottom surface of the two lightemitting diodes are arranged in an order of N-type pad, P-type pad,P-type pad, and N-type pad), such that a flexibility of an arrangementof the light unit 3 can be enhanced. Furthermore, a circuit part of thepatterned metal layers can be a metalized layer or an electroplatedmetal layer.

Furthermore, as shown in FIG. 9 , in the present embodiment, at leastone function element can be disposed in the base 1. For example, in apreferred embodiment, the at least one function element can be anembedded anti-static element, so that damage to the light unit 3 causedby a voltage surge or voltage spike can be avoided. In anotherembodiment, the function element can be a semiconductor element, such asa Zener diode, a resistor, a capacitor, or an inductor, but is notlimited thereto. In addition, in one embodiment, as shown in FIG. 9 ,the second substrate 12 can be a composite circuit board, that is, thefunction element is embedded within the second substrate 12, and the twoP-type pads of the two light emitting diodes of the light unit 3 arearranged adjacent to each other. Therefore, one of the first connections213 can be shared by the two light emitting diodes of the light unit 3,and two function elements are respectively and electrically connected tohorizontal extension parts of two second connections 214 thatrespectively correspond to the P-type pads of the two light emittingdiodes in the second substrate 12, so that the damage to the light unit3 caused by the voltage surge or the voltage spike can be avoided, and aspace used by an external circuit can be reduced.

However, the aforementioned details are disclosed for exemplary purposesonly, and are not meant to limit the scope of the present disclosure.

Third Embodiment

Referring to FIG. 12 , a main difference between a third embodiment andthe second embodiment is that the bases 1 of the third embodiment andthe second embodiment include different numbers of substrates. The base1 of the third embodiment is a four-layer board structure (i.e.,including five layers of circuits), which includes the first substrate11, the second substrate 12, the adhesive layer 13 connected between thefirst substrate 11 and the second substrate 12, a third substrate 14,and a fourth substrate 15. The fourth substrate 15, the third substrate14, the second substrate 12, the adhesive layer 13, and the firstsubstrate 1 are arranged from top to bottom. The first substrate 11, thesecond substrate 12, the third substrate 14, and the fourth substrate 15can be made of the same material or different materials. For example,the first substrate 11, the second substrate 12, the third substrate 14,and the fourth substrate 15 can be the FR4 substrate or the prepreg(PP), but is not limited thereto. In the present embodiment, theconductive unit 2 includes the first connection 213 connected to thesolder pad 212 on a bottom surface of the base 1 and passing through thefirst substrate 11, the second connection 214 passing through the secondsubstrate 12, a third connection 216 passing through the third substrate14, and a fourth connection 217 connected to the chip bonding pad 211 onthe top surface of the base 1 and passing through the fourth substrate15. In addition, the adhesive layer 13 can be made of the polymermaterial, and the adhesive layer 13 includes the intermediate conductivepart 215. The first connection 213, the intermediate conductive part215, the second connection 214, the third connection 216, and the fourthconnection 217 correspond to each other, and the first connection 213 iselectrically connected to the fourth connection 217 through theintermediate conductive part 215, the second connection 214, and thethird connection 216, thereby providing an electrical conductive path.

However, the aforementioned details are disclosed for exemplary purposesonly, and are not meant to limit the scope of the present disclosure.

Fourth Embodiment

Referring to FIG. 13A to FIG. 13C, FIG. 14A, and FIG. 14B, a maindifference between a fourth embodiment and the first embodiment to thethird embodiments is that, the light emitting chip of the light unit 3of the fourth embodiment is a chip scale packaging (CSP) light emittingdiode (LED), and particularly a white CSP light emitting diode (WCSPLED). The light unit 3 includes at least two WSCP LEDs, and the WSCP isa design with an encapsulate 46 including a wavelength convertingmaterial directly formed on a top surface and/or a side surface of thechip and with P-type and N-type electrodes arranged on a bottom surfaceof the chip exposed, but the present disclosure is not limited thereto.

It is worth mentioning that, as shown in FIG. 13A and FIG. 13B, theencapsulate 46 formed on the chip described above can be regarded as thefirst package body 41, and after the WCSP LEDs are disposed on the base1, the second package body 41 is formed to cover the WSCP LEDs(including the light emitting chip and the encapsulate 46 (i.e., thefirst package body 41)). For example, the first package body 41 is thewavelength converting material, and the second package body 42 includesthe translucent material or a translucent gel including alight-diffusing material. In one embodiment, as shown in FIG. 13C, thefirst package body 41 and the WCSP LED are integrally formed, i.e., theWCSP LED includes the light emitting chip, the encapsulate 46, and thefirst package body 41, and the first package body 41 surrounds the WCSPLED. Then, the WCSP LED including the first package body 41 is disposedon the base 1, and the second package body 42 is formed to cover theWCSP LED and the first package body 41. In another embodiment, as shownin FIG. 14A and FIG. 14B, the WCSP LED including the encapsulate 46 isdisposed on the base 1, the first package body 41 is formed to surroundthe WCSP LED, and then the second package body 42 is formed to cover theWCSP LED and the first package body 41. For example, the first packagebody 41 can include the reflective material, and the second package body42 can include the translucent material or further the light-diffusingmaterial.

However, the aforementioned details are disclosed for exemplary purposesonly, and are not meant to limit the scope of the present disclosure.

Fifth Embodiment

Based on the above embodiments, which are read in conjunction with FIG.15A and FIG. 15B, a fifth embodiment of the present disclosure providesa light source module, which includes at least one light emitting deviceS as in the above embodiments, a circuit board 5, and a light guidemember 6. The at least one light emitting device S as in the aboveembodiments has been described in the above embodiments, and is notreiterated herein. More specifically, in the present embodiment, thelight source module is a lateral light source module. In other words, amain direction of light emitted by the light emitting device S as in theabove embodiments is parallel to the circuit board 5. The circuit board5 is perpendicular to a mounting surface, and the conductive unit 2 ofthe light emitting device S can be electrically connected to the circuitboard 5 through a solder ball B. The circuit board 5 can be the flexibleprinted circuit (FPC), the FR4 substrate, the prepreg (PP), a ceramicprinted circuit board (PCB), or a TEFLON® PCB, but the presentdisclosure is not limited thereto.

The light guide member 6 can include a transparent material or asemitransparent material, and a shape, a size, or an extension directionof the light guide member 6 can be adjusted according to the user'srequirement or the actual application, but the present disclosure is notlimited thereto. In a preferred embodiment, a length and a width of across-section of the light guide member 6 can respectively be equal toor greater than a length and a width of a cross-section of the lightemitting device S, i.e., an area of the cross-section of the light guidemember 6 is equal to or greater than an area of the cross-section of thelight emitting device S. The light guide member 6 is adjacent to anilluminating surface of the light emitting device S, and preferably canbe disposed on the circuit board 5 and be adjacent to the illuminatingsurface of the light emitting device S, so that light L emitted by thelight emitting device S enters the light guide member 6 through a lightincident surface 61 to a greater extent, and then the light L isuniformly emitted from a light exit surface 62 after being transmittedin the light guide member 6. In addition, an emission direction of thelight L emitted by the light emitting device S, for example but notlimited to, a direction parallel to the circuit board 5, can be adjustedby passing through the light exit surface 62 of the light guide member6, so that most of the light L can be emitted toward a predetermineddirection as desired.

As shown in FIG. 15A and FIG. 15B, in order to enhance overall lightemitting efficiency, the light source module can also include at leastone shading member 7. The shading member 7 can include a material havingan opaque property or a shading property, for example but not limitedto, a thermal curing resin, a thermoplastic resin, polyphthalamide(PPA), or a polymer resin. The reflective material, for example but notlimited to, silicon oxide, titanium oxide, or a combination thereof, canbe added to the resin. Furthermore, the shading member 7 iscorrespondingly disposed on one side of the light emitting device S thatis opposite to another side of the light emitting device S through whichthe light emitting device S is disposed on the circuit board 5, and apart of one side of the light guide member 6 that is opposite to anotherside of the light guide member 6 through which the light guide member 6is disposed on the circuit board 5. Moreover, in order to increase acontrast ratio or to enhance a light intensity in a particular directionof the light L emitted by the light emitting device S, an area of theshading member 7 is greater than an area of the one side of the lightemitting device S that is opposite to the another side of the lightemitting device S through which the light emitting device S is disposedon the circuit board 5, so as to absorb unwanted lateral light emittedby the light emitting device S (as shown in FIG. 15A) or to reflectlateral light (as shown in FIG. 15B).

However, the aforementioned details are disclosed for exemplary purposesonly, and are not meant to limit the scope of the present disclosure.

Beneficial Effects of the Embodiments

In conclusion, one of the beneficial effects of the present disclosureis that, in the light emitting device and the light source moduleprovided by the present disclosure, by virtue of “the package 4including the first package body 41 surrounding the light unit 3 and thesecond package body 42 covering the light unit 3 and the first packagebody 41, and the first package body 41 and the second package body 42having different optical properties,” a size of the light emittingdevice can be reduced so as to achieve an effect of miniaturization, andthe light emitting efficiency can be effectively improved.

Another one of the beneficial effects of the present disclosure is that,in the light emitting device and the light source module provided by thepresent disclosure, by virtue of “the function element being disposed inthe base 1,” the damage to the light unit 3 caused by the voltage surgeor the voltage spike can be avoided, and the space used by the externalcircuit can be reduced.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A light emitting device, comprising: a baseincluding a first substrate and n through holes, wherein each of the nthrough holes passes through the first substrate; a conductive unitincluding m conductors, wherein the m conductors are separate from eachother and each of the m conductors passes through the first substrate,wherein each of the m conductors includes a chip bonding pad disposed ona top surface of the base, a solder pad exposed from a bottom surface ofthe base, and a first connection connected between the chip bonding padand the solder pad, and wherein a part of the first connection isarranged in the through hole; a light unit correspondingly andelectrically connected to the m conductors; and a package including afirst package body and a second package body, wherein the first packagebody surrounds the light unit, and the second package body covers thelight unit and the first package body; wherein the first package bodyand the second package body have different optical properties; wherein mand n are integers greater than or equal to 2, and m is greater than orequal to n; wherein the first package body has a contact part, and thecontact part is adjacent to the light unit, and a surface of the contactpart is in a shape of a round corner, a bevel, or an arcuate slot;wherein a maximum thickness of the contact part of the first packagebody is not more than 1.5 times a height of the light unit, and aminimum thickness of the contact part is not less than 0.5 times theheight of the light unit.
 2. The light emitting device according toclaim 1, wherein a maximum thickness of the first package body is notless than a height of the light unit, and a ratio of a thickness of thesecond package body to the thickness of the first package body isbetween 0.5 and
 2. 3. The light emitting device according to claim 1,wherein, when the first package body is a reflective material or alight-absorbing material, the second package body is a translucentmaterial; wherein, when, the first package body is a translucentmaterial, the second package body is a reflective material or alight-absorbing material.
 4. The light emitting device according toclaim 3, wherein the first package body or the second package body ismade of transparent resin, wavelength converting resin, orsemitransparent resin.
 5. The light emitting device according to claim1, wherein the package further includes: at least one first reflectivestructure arranged on the first package body; wherein the second packagebody has two first sides that are opposite to each other, and two secondsides that are opposite to each other, and the at least one firstreflective structure is at least adjacent to the two first sides or thetwo second sides of the second package body.
 6. The light emittingdevice according to claim 1, wherein the package further includes: athird package body arranged on the second package body; wherein thethird package body and the second package body have different opticalproperties, and a ratio of a thickness of the third package body to athickness of the first package body is between 0.5 and
 2. 7. The lightemitting device according to claim 6, wherein the package furtherincludes: a second reflective structure arranged on the first packagebody; wherein the second package body has two first sides that areopposite to each other, and two second sides that are opposite to eachother, the third package body has two first sides that are opposite toeach other, and two second sides that are opposite to each other, andthe at least one second reflective structure is at least adjacent to thetwo first sides of the second package body and the two first sides ofthe third package body, or at least adjacent to the two second sides ofthe second package body and the two second sides of the third packagebody.
 8. The light emitting device according to claim 1, wherein the mconductors is arranged in a form of a first patterned metal layer and asecond patterned metal layer of the first substrate; wherein the firstpatterned metal layer includes a plurality of square portions orcircular portions that each has an extension part, and the secondpatterned metal layer includes a plurality of arched portions that eachhas a recess corresponding to the extension part of the first patternedmetal layer.
 9. The light emitting device according to claim 8, whereinthe light unit includes two light emitting diodes, and a distancebetween any two extension parts that respectively correspond to the twolight emitting diodes and adjacent to each other is less than a distancebetween any two extension parts that correspond to a same light emittingdiode.
 10. The light emitting device according to claim 1, wherein thebase further includes: a second substrate; and an adhesive layer;wherein the adhesive layer is connected between the first substrate andthe second substrate, and the second substrate is arranged between thefirst substrate and the light unit; wherein the conductive unit furtherincludes: a second connection connected to the chip bonding pad on thetop surface of the base and passing through the second substrate;wherein the adhesive layer includes an intermediate conductive part;wherein each of an orthographic projection of the first connection andan orthographic projection of the second connection corresponds to theintermediate conductive part, and the first connection is electricallyconnected to the second connection through the intermediate conductivepart.
 11. The light emitting device according to claim 10, wherein the mconductors are arranged in a form of a top patterned metal layer, asecond substrate patterned metal layer, a first patterned metal layer,and a second patterned metal layer; wherein at least a part of the toppatterned metal layer, at least a part of the second substrate patternedmetal layer, at least a part of the first patterned metal layer, and atleast a part of the second patterned metal layer correspond to eachother; wherein each of a number of patterns of the top patterned metallayer and a number of patterns of the second substrate patterned metallayer is greater than or equal to each of a number of patterns of thefirst patterned metal layer and a number of patterns of the secondpatterned metal layer.
 12. The light emitting device according to claim10, wherein the top patterned metal layer includes a plurality of squareportions, the second substrate patterned metal layer includes aplurality of circular portions, the first patterned metal layer includesa plurality of circular portions or square portions, where each has anextension part, and the second patterned metal layer includes aplurality of arches where each has a recess.
 13. The light emittingdevice according to claim 10, further comprising: at least onesemiconductor element embedded within the second substrate; wherein thesecond connection has a horizontal extension part within the secondsubstrate and electrically connected to the least one semiconductorelement and the corresponding one bonding pad and the corresponding onesolder pad of the m conductors.
 14. The light emitting device accordingto claim 10, wherein the base further includes: a third substrate; and afourth substrate; wherein the fourth substrate, the third substrate, thesecond substrate, the adhesive layer, and the first substrate arearranged from top to bottom; wherein the conductive unit furtherincludes: a third connection passing through the third substrate; and afourth connection connected to the chip bonding pad on the top surfaceof the base and passing through the fourth substrate; wherein the firstconnection, the intermediate conductive part, the second connection, thethird connection, and the fourth connection correspond to each other,and the first connection is electrically connected to the fourthconnection through the intermediate conductive part, the secondconnection, and the third connection.
 15. A light emitting device,comprising: a base at least including a first substrate and n throughholes, wherein each of the n through holes passes through the firstsubstrate; a conductive unit including m conductors, wherein the mconductors are separate from each other and each of the m conductorspasses through the first substrate, wherein each of the m conductorsincludes a chip bonding pad, a solder pad, and a first connection,wherein the chip bonding pad is disposed on a top surface of the base,the solder pad is exposed from a bottom surface of the base, and thefirst connection is connected between the chip bonding pad and thesolder pad, and wherein a part of the first connection is arranged inthe through hole; at least one chip scale packaging light emitting diode(CSP-LED) correspondingly and electrically connected to neighboring twoof the m conductors; and a package covering the at least one CSP-LED;wherein the at least one CSP-LED includes an encapsulation formed on alight emitting chip, and the encapsulation and the package havedifferent optical properties; wherein m and n are integers greater thanor equal to 2, and m is greater than or equal to n; wherein theencapsulation of the at least one CSP-LED is a wavelength convertingmaterial or a wavelength converting material surrounded by a firstpackage body.
 16. A light source module, comprising: a circuit board; atleast one light emitting device according to claim 1 disposed on thecircuit board, wherein the at least one light emitting device issoldered to the circuit board through the first connections respectivelydisposed in the through holes; and a light guide member adjacent to anilluminating surface of the at least one light emitting device.
 17. Thelight source module according to claim 16, further comprising: a shadingmember correspondingly disposed on one side of the at least one lightemitting device that is opposite to another side of the at least onelight emitting device through which the at least one light emittingdevice is disposed on the circuit board, and a part of one side of thelight guide member that is opposite to another side of the light guidemember through which the light guide member is disposed on the circuitboard; wherein an area of the shading member is greater than an area ofthe one side of the at least one light emitting device that is oppositeto the another side of the at least one light emitting device throughwhich the light emitting device is disposed on the circuit board.
 18. Alight emitting device, comprising: a base including a first substrateand n through holes, wherein each of the n through holes passes throughthe first substrate; a conductive unit including m conductors, whereinthe m conductors are separate from each other and each of the mconductors passes through the first substrate, wherein each of the mconductors includes a chip bonding pad disposed on a top surface of thebase, a solder pad exposed from a bottom surface of the base, and afirst connection connected between the chip bonding pad and the solderpad, and wherein a part of the first connection is arranged in thethrough hole; a light unit correspondingly and electrically connected tothe m conductors; and a package including a first package body and asecond package body, wherein the first package body surrounds the lightunit, and the second package body covers the light unit and the firstpackage body; wherein the first package body and the second package bodyhave different optical properties; wherein m and n are integers greaterthan or equal to 2, and m is greater than or equal to n; wherein, whenthe first package body is a reflective material or a light-absorbingmaterial, the second package body is a translucent material; wherein,when, the first package body is a translucent material, the secondpackage body is a reflective material or a light-absorbing material.